5331 McFadden Avenue

Huntington Beach, CA 92649

p 714.898.4901

© 2016 Coast to Coast Circuits, Inc. All rights reserved.

CAPABILITIES

Coast to Coast Circuits, Inc., is recognized as a premier fabricator of complex printed circuit boards (PCBs), including RF/Microwave/mm-wave, Semiconductor IC packaging substrates, Flex and Rigid Flex, High Density Interconnect (HDI) and Multichip Modules (MCM-L). We are a specialty manufacturer with high mix, low volume, experienced in a wide variety of standard and advanced materials as well as blind/buried vias, sequential lamination, filled vias, fine lines and spaces, cavity creation and controlled impedance (to name a few of our capabilities). Please use the links below to research additional information about some of our standard and advanced capabilities:

Printed Circuit Boards (PCBs) 
Flexible & Rigid-Flex Circuits 

RF / Microwave / Millimeter-wave Interconnects

High Density Interconnects PCBs 

IC Packaging Substrates / Chip Scale Packaging 

Advanced Capabilities / Specialty Technologies & Materials

PCB Capabilities

  • Multilayers up to 30 layers

  • Blind and buried vias / sequential lamination

  • HDI/Laser micro vias

  • Down to 2 mil lines/spaces

  • Down to 6 mill drilled holes / 2 mil laser vias

  • Down to 1 mil front to back core registration

  • Filled vias - conductive / non-conductive

  • Controlled impedance

  • Advanced material sets

  • Full array of ROHS finishes in house

Advanced PCB Capabilities

  • Via-in-pad (thru and micro vias)

  • Mixed dielectrics and special materials such as LCP

  • Edge plating / castellations

  • Cavity designs

  • Stacked vias

  • Copper sealed thruholes

  • Back drill thruholes for RF purposes

  • Copper filled micro vias

  • Nodule-free wire bond surfaces

  • Embedded resistors

  • High aspect ratio thru hole

Key Equipment:

  • Orbotech Paragon 8800 (dual resolution) Laser Direct Imaging system

  • Excellon Concept 129 Vision Drill System

  • Xact PCB registration and scaling software

  • Lauffer hot oil- high temp lamination presses

  • New modular plating tank technology

  • Laser micro vias plating technology

  • Chemcut DES

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